COOLPad® Silicon Thermal PADs
COOLPad® is a line of high performance thermal interface pads, developed to address the industry’s growing requirements for easy application, low levels of thermal resistance and high conformability, even at the most challeging and uneven surfaces.
FlexGRAF® Thermally Conductive Graphite
FlexGRAF® redefines thermal interface materials with its exceptional thermal conductivity, delivering uniform heat distribution both in and through the plane. This property effectively prevents hotspot formation, ensuring reliable and efficient thermal management.
THERMALTape® Thermally Conductive Tapes
THERMALTape® is a double-sided adhesive tape with ultra-high adhesion strength which can be used to attach componentes and PCI (Circuit Boards) to heatsinks, eliminating the use of mechanical fixing elements ensuring low thermal resistance interface and thus optimizing the heat flow to the environment.
FORMAPad® Dispensable Gap Pads
FORMAPad® combines the best features of a high-performance Thermal Grease and those of Silicone Thermal Pads. It is available as mono and bi-component products, which are applied in the same way that a liquid adhesive or a thermal grease, filling perfectly even the most uneven surfaces.
LEDGlue® Silicon Adhesives
LEDGlue® is a fluid silicone adhesive, which has been developed to provide excellent thermal conductivity, besides the mechanical attachment of the eletronic components. It adhesives are ideal elastomeric solution for intense heat generating components.
COOLPhase® PHASE CHANGE THERMAL PADS
COOLPhase® sets a new standard in thermal management solutions, providing.durability and effective heat transfer for a wide range of applications.