The COOLPhase® series is made up of non-silicone high-performance polymer matrix materials that have exceptional wettability, reducing the thermal contact resistance between heat-generating and heat-dissipating surfaces. At operating temperatures between 50 °C and 60 °C, this tough PCM material will soften, naturally flowing to fill the air gaps between contact surfaces and providing long-term reliability with no degradation like those found in thermal pastes.

Features

• h-Thermal condutivity
• Super low contact resistance
• Easy to assemble
• RoHs & REACH compliant

FlexGRAF® is a thermal interface material with superior thermal conductivity, both in and trough-plane, which enables a homogenous thermal distribution inhibiting the formation of hot-spots. Its flexible nature allows it to be cut into diverse geometries and its good compressibility reduces thermal contact resistance, making it a good choice for applications that require long-term performance. FlexGRAF® is RoHS and Reach Compliant.

Features

• High operating temperature resistance up to 400°C
• Very high heat dissipation
• Might be laminated with a electrical
• Insulation foil to offer dielectric resistance